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Imaging antique coins with beams of low-energy neutrons, researchers at the National Institute of Standards and Technology (NIST) and their colleagues have
Using an electron beam to image the tiniest of defects and patterns on microchips, the scanning electron microscope (SEM) has long been a mainstay of the
Using an electron beam to image the tiniest of defects and patterns on microchips, the scanning electron microscope (SEM) has long been a mainstay of the
Blog Posts
Houston, We Have the Engine Remnants: How My Lab Pieced Together a Forgotten Part of an Apollo Rocket
X-ray stage mapping (XSM) can be used to determine the extent of heterogeneity on the micron scale though it is more time consuming and not as accurate as the more rigorous NIST random-point (RP) testing procedure. The objective of this work is to demonstrate the advantage of the latter procedure
Project activities include: Electronic structure of semiconductor-oxide interfaces. Thermodynamics of flexible microporous materials for gas storage Gas adsorption in microporous materials Analysis of topological materials, including magnetic topological insulators High-throughput screening of
This program seeks to continually enhance the analytical competence of MML and other major operating units at NIST. Furthermore, the program makes available technical capabilities that U.S. industry and government need in their quest to compete on a global scale through improving methods and
Designing New High Temperature Co Superalloys In collaboration with the NIST CHiMaD center, an ICME approach in being used to develop new Co superalloys that are strengthened using an ordered FCC (L1 2) phase (similar to the related Ni-based superalloys). The design goals for these alloys include
Deposition of carbonaceous material under electron beam irradiation is an old and persistent problem of scanning electron microscopy. It is an impediment to
Youngju Kim, Michael Daugherty, Caitlyn Wolf, Daniel Hussey, Jacob LaManna, David Jacobson, Paul A. Kienzle, Daeseung Kim, Seung Wook Lee, Minsoo Han, Hahn Choo, Jongyul Kim, Taejoo Kim
Distinguishing differences between authentic artifacts and replicas is a significant challenge in the field of cultural heritage. In this study, we explore the
Andrew Iams, Jordan Weaver, Brandon Lane, Lucille Giannuzzi, Feng Yi, Darby LaPlant, John Martin, Fan Zhang
Additive manufacturing (AM) has captured recent attention for its potential to fabricate high-strength aluminum alloy components. A detailed understanding of
Boris Slautin, Yungtao Liu, Yu Liu, Reece Emery, Seungbum Hong, Astita Dubey, Vladimir Shvartsman, Doru Lupascu, Sheryl Sanchez, Mahshid Ahmadi, Yunseok Kim, Evgheni Strelcov, Keith Brown, Philip Rack, Sergei Kalinin
For over three decades, scanning probe microscopy (SPM) has been a key method for exploring material structures and functionalities at nanometer and often
We implemented a Bayesian-statistics approach for subtraction of incoherent scattering from neutron total-scattering data. In this approach, the estimated
GSAS_USE addresses the effects of systematic errors in Rietveld refinements. The errors are categorized into multiplicative, additive, and peak-shape types
LEAP 4000X Si/HR Imaging time-of-flight mass spectrometer and field ion microscope. Can deliver 3-D, isotopically- and chemically- resolved images Sub-nanometer
This in-situ indentation system can be integrated into electron microscopes as well as being run in other unusual setups. With a load capacity of 150 mN, this
A TESCAN MIRA3 Schottky field-emission scanning electron microscope with 4 30 mm 2 silicon x-ray drift detectors which has been automated for particle and